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 DATA SHEET
NEC's GaAs MMIC DPDT SWITCHES UPG2024TQ FOR 5 GHz BAND WIRELESS LAN
FEATURES
* OPERATING FREQUENCY: f = 4.8 to 5.85 GHz * LOW INSERTION LOSS: LINS = 1.2 dB TYP. @ f = 4.8 to 5.85 GHz * HANDLING POWER: Pin (0.1 dB) = +32 dBm TYP. @ f = 4.8 to 5.85 GHz * CONTROL VOLTAGE: Vcont = +2.8 V/0 V TYP. * HIGH ISOLATION: ISL (between TX and RX) = 30 dB TYP. @ f = 5.2 GHz ISL (between ANT1/ANT2 and RX/TX) = 25 dB TYP. @ f = 5.2 GHz * INPUT/OUTPUT RETURN LOSS: RLin/RLout = 20 dB TYP. @ f= 4.8 to 5.85 GHz * SWITCHING SPEED: tSW = 20 ns TYP. @ tRISE/tFALL (10/90% RF) * HIGH-DENSITY SURFACE MOUNTING: 10-pin plastic TSON package (2.30 x 2.55 x 0.60 mm) * Pb FREE
DESCRIPTION
NEC's UPG2024TQ is a GaAs MMIC DPDT switch for 5 GHz band wireless LAN. Low insertion loss and high handling power contribute to user's system design.
APPLICATIONS
* 5 GHz Band Wireless LAN (IEEE802.11a)
ORDERING INFORMATION
PART NUMBER UPG2024TQ-E1-A ORDER NUMBER UPG2024TQ-E1-A PACKAGE 10-pin plastic TSON (Pb-Free) MARKING 2024 SUPPLYING FORM * Embossed tape 8 mm wide * Pin 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2024TQ
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
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UPG2024TQ PIN CONNECTIONS
(Top View)
10 9 8 7 6
(Bottom View)
6 7 8 9 10
PIN NO. 1 2 3 4
PIN NAME TX Vcont1 Vcont2 GND RX ANT1 Vcont3 Vcont4 GND ANT2
2024
1 2 3 4 5 5
GND
4 3 2 1
5 6 7 8 9 10
ABSOLUTE MAXIMUM RATINGS
PARAMETER Control Voltage Input Power Total Power Dissipation Operating Ambient Temperature Storage Temperature SYMBOL Vcont Pin Ptot TA Tstg
(TA = +25C, unless otherwise specified ) RATINGS -6.0 to +6.0 Note 1 +36 0.15 Note 2 -45 to +85 -65 to +150 UNIT V dBm W C C
Notes 1. Within the condition of | Vcont1-Vcont2 | 6.0 V 2. Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C
RECOMMENDED OPERATING RANGE
PARAMETER Control Voltage (High) Control Voltage (Low) Operating Frequency Operating Ambient Temperature SYMBOL Vcont (H) Vcont (L) f TA MIN. 2.7 -0.2 4.8 -40
(TA = +25C ) TYP. 2.8 0 - +25 MAX. 3.3 +0.2 5.85 +85 UNIT V V GHz C
2
UPG2024TQ ELECTRICAL CHARACTERISTICS
unless otherwise specified)
PARAMETER Insertion Loss SYMBOL LINS TEST CONDITIONS f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz Isolation (Between TX and RX) Input Return Loss RLin ISL f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz Output Return Loss RLout f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz 0.1 dB Gain Compression Input Power Switching Speed Control Current Input 3rd Order Intercept Point tSW Icont IIP3 Pin (0.1 dB) f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz tRISE/tFALL (10/90% RF) MIN. - - - 20 25 20 10 10 7 10 10 7 30 30 30 - - - TYP. 1.2 1.2 1.5 25 30 25 20 20 20 20 20 20 33 32 32 20 0.5 50 MAX. 1.5 1.5 1.7 - - - - - - - - - - - - - - - ns A dBm dBm dB dB dB UNIT dB
(TA = +25C, Vcont = 2.8 V/0 V, ZO = 50 , DC block capacitor = 2 pF, each port, on the below TRUTH TABLE,
STANDARD CHARACTERISTICS FOR REFERENCE
unless otherwise specified)
PARAMETER Isolation (Between ANT1/ANT2 and RX/TX) SYMBOL ISL
(TA = +25C, Vcont = 2.8 V/0 V, ZO = 50 , DC block capacitor = 2 pF, each port, on the below TRUTH TABLE,
TEST CONDITIONS f = 4.9 GHz f = 5.2 GHz f = 5.8 GHz MIN. - - - TYP. 22 25 21 MAX. - - - UNIT dB
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UPG2024TQ TEST CIRCUIT
ANT2 Vcont4 Vcont3 ANT1
Cbypass CRF GND
10 9 8 7
Cbypass CRF
6
1
2
3
4
5
GND CRF Cbypass Cbypass CRF
TX
Vcont1 Vcont2
RX
Remark CRF : 2 pF Cbypass : 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
TRUTH TABLE
Vcont1 Low High High Low Vcont2 High Low Low High Vcont3 High Low High Low Vcont4 Low High Low High PASS ANT1-RX ANT2-TX ANT1-TX ANT2-RX
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UPG2024TQ ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
.
CRF
CRF
Cbypass
Cbypass
Cbypass CRF
Cbypass CRF
USING THE NEC EVALUATION BOARD
SYMBOL CRF Cbypass - - - FORM Chip Capacitor Chip Capacitor PC Terminal RF Connector PWB RATING 2 pF 1 000 pF - - - PART NUMBER GRM36CK020C50PB GRP033B11C102KD01E A2-2PA-2.54DSA 142-0721-821 RO4003 (t = 0.51 mm) MANUFACTURER muRata muRata Hirose Johnson Rogers
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UPG2024TQ STANDARD CHARACTERISTICS FOR REFERENCE
TX-ANT1 INSERTION LOSS vs. FREQUENCY (When TX-ANT1 is ON)
0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
(TA = +25C, Vcont = 2.8 V/0 V, ZO = 50 , DC block capacitor = 2 pF, using test fixture, unless otherwise specified)
ANT1-RX INSERTION LOSS vs. FREQUENCY (When ANT1-RX is ON)
0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
Insertion Loss LINS (dB)
TX-ANT2 INSERTION LOSS vs. FREQUENCY (When TX-ANT2 is ON)
0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
Insertion Loss LINS (dB) Insertion Loss LINS (dB)
ANT2-RX INSERTION LOSS vs. FREQUENCY (When ANT2-RX is ON)
0 -0.5 -1.0 -1.5 -2.0 -2.5 -3 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
Insertion Loss LINS (dB)
RX-TX ISOLATION vs. FREQUENCY (When ANT2-RX is ON)
0 -10 Isolation ISL (dB) -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Isolation ISL (dB) 0 -10 -20 -30 -40
TX-RX ISOLATION vs. FREQUENCY (When TX-ANT1 is ON)
-50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
6
UPG2024TQ
TX-ANT1 INPUT RETURN LOSS vs. FREQUENCY (When TX-ANT1 is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
TX-ANT1 OUTPUT RETURN LOSS vs. FREQUENCY (When TX-ANT1 is ON)
0 Output Return Loss RLout (dB) -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
Input Return Loss RLin (dB)
TX-ANT2 INPUT RETURN LOSS vs. FREQUENCY (When TX-ANT2 is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Output Return Loss RLout (dB) Input Return Loss RLin (dB)
TX-ANT2 OUTPUT RETURN LOSS vs. FREQUENCY (When TX-ANT2 is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
ANT1-RX INPUT RETURN LOSS vs. FREQUENCY (When ANT1-RX is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Output Return Loss RLout (dB) Input Return Loss RLin (dB)
ANT1-RX OUTPUT RETURN LOSS vs. FREQUENCY (When ANT1-RX is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
7
UPG2024TQ
ANT2-RX INPUT RETURN LOSS vs. FREQUENCY (When ANT2-RX is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz) Output Return Loss RLout (dB) Input Return Loss RLin (dB)
ANT2-RX OUTPUT RETURN LOSS vs. FREQUENCY (When ANT2-RX is ON)
0 -10 -20 -30 -40 -50 4.0 4.3 4.6 4.9 5.2 5.5 5.8 6.1 6.4 6.7 7.0 Frequency f (GHz)
4.9 GHz OUTPUT POWER vs. INPUT POWER
35 Output Power Pout (dBm)
5.2 GHz OUTPUT POWER vs. INPUT POWER
35 Output Power Pout (dBm)
30
30
25
25
20
20
15 20
25
30
Input Power Pin (dBm)
Pin (0.1 dB) = +33.5 dBm
35
38
15 20
25
30
Input Power Pin (dBm)
Pin (0.1 dB) = +33.5 dBm
35
38
5.8 GHz OUTPUT POWER vs. INPUT POWER
35
Output Power Pout (dBm)
30
25
20
15 20
25
30
Input Power Pin (dBm)
Pin (0.1 dB) = +33.4 dBm
35
38
Remark The graphs indicate nominal characteristics.
8
UPG2024TQ PACKAGE DIMENSIONS 10-PIN PLASTIC TSON (UNIT:mm)
0.400.05 0.180.05 (0.05) (0.15) (0.30) (0.30) (1.95) (1.70)
(Bottom View)
2.550.15
2.250.1
2.200.1 2.300.15 (0.125) (0.60 MAX.)
Remark ( ) : Reference value
9
(0.95)
UPG2024TQ
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office.
SOLDERING METHOD Infrared Reflow SOLDERING CONDITIONS Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below CONDITION SYMBOL IR260
Wave Soldering
WS260
Partial Heating
HS350
Caution Do not use different soldering methods together (except for partial heating).
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
05/04/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
10
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.
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